Quantifying the Impact of Monolithic 3D (M3D) Integration on L1 Caches

Author:

GONG YOUNG-HOORCID,KONG JOONHOORCID,CHUNG SUNG WOOORCID

Funder

National Research Foundation of Korea

Nano Material Technology Development Program

Ministry of Science, ICT and Future Planning

Samsung

Korea University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Computer Science Applications,Human-Computer Interaction,Information Systems,Computer Science (miscellaneous)

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal Effects on Monolithic 3D Ferroelectric Transistors for Deep Neural Networks Performance;Advanced Intelligent Systems;2024-07-03

2. TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12

3. Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology;2023 IEEE 41st International Conference on Computer Design (ICCD);2023-11-06

4. 3D SRAM Macro Design in 3D Nanofabric Process Technology;IEEE Transactions on Circuits and Systems I: Regular Papers;2023-07

5. Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration;2023 24th International Symposium on Quality Electronic Design (ISQED);2023-04-05

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