A Bidirectional- and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications-Reference-Cited by-同舟云学术

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A Bidirectional- and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications

Published:2008-04 Issue:4 Volume:43 Page:1020-1029
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Ito Hiroyuki,Kimura Makoto,Miyashita Kazuya,Ishii Takahiro,Okada Kenichi,Masu Kazuya

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/4/4476475/04476492.pdf?arnumber=4476492

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Use of current-mode and voltage-mode receivers together for on-chip multipoint-to-multipoint data transmission across global interconnects;2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID);2024-01-06

2. Optical Interconnects Finally Seeing the Light in Silicon Photonics: Past the Hype;Nanomaterials;2022-01-29

3. A full‐duplex transceiver for 20‐Gbps high‐speed simultaneous bidirectional signaling across global on‐chip interconnections;International Journal of Circuit Theory and Applications;2021-08-26

4. Hybrid bidirectional transceiver for multipoint‐to‐multipoint signalling across on‐chip global interconnects;IET Circuits, Devices & Systems;2020-09

5. A 16 Gbps, Full-Duplex Transceiver over Lossy On-Chip Interconnects in 28 nm CMOS Technology;Electronics;2020-04-26

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