Author:
Geen J.A.,Sherman S.J.,Chang J.F.,Lewis S.R.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
187 articles.
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5. Modeling and Experimental Analysis of Low-Cost MEMS Gyroscopes Under PCB Bending Stress;2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2023-03-28