Modeling and Experimental Analysis of Low-Cost MEMS Gyroscopes Under PCB Bending Stress-Reference-Cited by-同舟云学术

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Modeling and Experimental Analysis of Low-Cost MEMS Gyroscopes Under PCB Bending Stress

Published:2023-03-28 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)
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Author:

Mayer Wolfram¹,Küster Alexandra¹,Tritschler Patrick¹,Hiller Tobias²,Radović Dušan¹,Zimmermann André³

Affiliation:

1. Bosch Sensortec GmbH, Engineering Advanced Systems,Reutlingen,Germany,72770

2. Robert Bosch GmbH, Engineering Advanced Concepts,Reutlingen,Germany,72762

3. University of Stuttgart, Institute for Micro Integration (IFM)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10103931/10103798/10103800.pdf?arnumber=10103800

Reference13 articles.

1. Analysis and Compensation of Cross-Axis Sensitivity in Low-Cost MEMS Inertial Sensors

2. Single-chip surface micromachined integrated gyroscope with 50°/h Allan deviation

3. System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation

4. Real-Time Built-In Self-Test of MEMS Gyroscope Based on Quadrature Error Signal

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improving the Temperature Stability of MEMS Gyroscope Bias with on-chip Stress Sensors;2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2024-03-25

2. Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes;IEEE Sensors Letters;2024-01

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