Author:
Zhang Renfu,Liu Hao,Li Bo,Sugiya Tetsukazu
Cited by
5 articles.
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1. A Predictive Model of Wafer-to-Die Warpage Simulation;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind;IEEE Transactions on Semiconductor Manufacturing;2023-05
3. Ultra thin die pickup: peel stage and pickup tool design comparison;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Technology Trends for Chip Thinning Process;Journal of The Japan Institute of Electronics Packaging;2019-08-01