Design and performance of a thin, solid layer for high-resolution, dry-contact acoustic imaging-Reference-Cited by-同舟云学术

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Design and performance of a thin, solid layer for high-resolution, dry-contact acoustic imaging

Published:2004-04 Issue:4 Volume:51 Page:432-438
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Tohmyoh H.,Saka M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/29253/01320807.pdf?arnumber=1320807

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Change in the waveform of broadband ultrasound reflected back from a sample via a polymer film;Japanese Journal of Applied Physics;2016-06-02

2. Theory and applications of high frequency broadband ultrasound via a thin layer in contact with a solid;Mechanical Engineering Reviews;2015

3. Measurement of the coating thickness on the back side of double-sided coated structures by means of acoustic resonant spectroscopy;Surface and Coatings Technology;2009-11

4. Selection of a solid layer for high-resolution acoustic imaging of IC packaging defects under dry-contact conditions;Mechanics of Materials;2009-10

5. Non-Destructive Inspection System for Bump Joints in Area-Arrayed Flip Chip Packaging Structures(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering);TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2009

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