Virtual thermo-mechanical prototyping of electronic packaging challenges in material characterization and modeling-Reference-Cited by-同舟云学术

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Virtual thermo-mechanical prototyping of electronic packaging challenges in material characterization and modeling

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Container-title:2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
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Author:

Zhang G.Q.,Tay A.A.O.,Ernst L.J.,Liu S.,Qian Z.F.,Bressers H.J.L.,Janssen J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7382/20058/00928032.pdf?arnumber=928032

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applied Modeling Framework in Integrated Circuit Design and Reliability;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Main principles of passive devices based on graphene and carbon films in microwave—THz frequency range;Journal of Nanophotonics;2017-02-03

3. Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies;Journal of Electronic Materials;2013-07-17

4. Experimental and Numerical Characterization of Non-Fickian Moisture Diffusion in Electronic Packages;IEEE Transactions on Advanced Packaging;2009-08

5. Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review;Journal of Electronic Packaging;2008-07-30

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