Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages-Reference-Cited by-同舟云学术

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Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages

Published: Issue: Volume: Page:
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Container-title:52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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Author:

Zahn B.A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7890/21740/01008301.pdf?arnumber=1008301

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach;2024-07-18

2. Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package;Microelectronics Reliability;2024-06

3. Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA);2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

4. Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents;Soldering & Surface Mount Technology;2023-08-28

5. Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging;Journal of Electronic Materials;2023-04-23

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