Eutectic Sn-Ag solder bump process for ULSI flip chip technology
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6887/18541/00853307.pdf?arnumber=853307
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrochemical co-deposition of ternary Sn–Bi–Cu films for solder bumping applications;Journal of Applied Electrochemistry;2006-07-05
2. Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint;Journal of Electronic Materials;2004-09
3. Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board;Journal of Electronic Packaging;2002-05-02
4. Under bump metallurgy study for Pb-free bumping;Journal of Electronic Materials;2002-05
5. Processing, properties, and reliability of electroplated lead-free solder bumps;ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
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