Degradation of gold-aluminium ball bonds by aging and contamination-Reference-Cited by-同舟云学术

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Degradation of gold-aluminium ball bonds by aging and contamination

Published:1995 Issue:4 Volume:18 Page:835-841
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Koeninger V.,Uchida H.H.,Fromm E.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/10163/00477471.pdf?arnumber=477471

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. An Optimized Ag–5Pd–3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-12

3. Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging;Journal of Electronic Materials;2020-10-21

4. Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-10

5. Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175∘C;Microelectronics International;2019-12-09

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