A 40-nm 118.44-TOPS/W Voltage-Sensing Compute-in-Memory RRAM Macro With Write Verification and Multi-Bit Encoding
Author:
Affiliation:
1. School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA
2. TSMC Corporate Research, Hsinchu, Taiwan
3. TSMC Design Technology, Hsinchu, Taiwan
Funder
Semiconductor Research Corporation through the Center for Brain-Inspired Computing
Applications and Systems-Driven Center for Energy-Efficient Integrated Nano Technologies
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/4/9718232/09689060.pdf?arnumber=9689060
Reference36 articles.
1. A 40 nm 100 Kb 118.44 TOPS/W ternary-weight computein-memory RRAM macro with voltage-sensing read and write verification for reliable multi-bit RRAM operation;yoon;Proc IEEE Custom Integr Circuits Conf (CICC),2021
2. 2-Bit-Per-Cell RRAM-Based In-Memory Computing for Area-/Energy-Efficient Deep Learning
3. Characterization and Mitigation of Relaxation Effects on Multi-level RRAM based In-Memory Computing
4. Ratio-based multi-level resistive memory cells;lastras-montaño;Sci Rep,2021
5. Impact of RTN on Pattern Recognition Accuracy of RRAM-Based Synaptic Neural Network
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