Affiliation:
1. Department of Electrical Engineering, Stanford University, Stanford, CA, USA
2. TSMC, Hsinchu, Taiwan
Funder
AI Chip Center for Emerging Smart Systems (ACCESS), Hong Kong, SAR
Defense Advanced Research Projects Agency (DARPA) 3DSoC Project
NSF FuSe-TG under
NSF Graduate Research Fellowship Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)