A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protection-Reference-Cited by-同舟云学术

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A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protection

Published:2024-07 Issue:7 Volume:59 Page:2330-2344
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Wan Meilin¹^ORCID,Zhang Zhen¹^ORCID,Zhang Yin²^ORCID,He Zhangqing²^ORCID,Gu Haoshuang¹,Dai Kui³,Zou Xuecheng⁴^ORCID

Affiliation:

1. School of Microelectronics, Hubei University, Wuhan, Hubei, China

2. School of Electrical and Electronic Engineering, Hubei University of Technology, Wuhan, China

3. Shenzhen Misec Technology Company Ltd., Shenzhen, Guangdong, China

4. School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/4/10575937/10410891.pdf?arnumber=10410891

Reference28 articles.

1. Reliable PUF-Based Local Authentication With Self-Correction

2. Low-overhead integrity verification for electronics and beyond;Zhang,2018

3. A 4-fJ/b Delay-Hardened Physically Unclonable Function Circuit With Selective Bit Destabilization in 14-nm Trigate CMOS

4. Helper Data Algorithms for PUF-Based Key Generation: Overview and Analysis

5. Trends in Hardware Security: From Basics to ASICs

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing security of Internet of Robotic Things: A review of recent trends, practices, and recommendations with encryption and blockchain techniques;Internet of Things;2024-12

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