IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management-Reference-Cited by-同舟云学术

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Published:2021-01 Issue:1 Volume:56 Page:79-97
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Vivet Pascal^ORCID,Guthmuller Eric,Thonnart Yvain^ORCID,Pillonnet Gael^ORCID,Fuguet Cesar,Miro-Panades Ivan^ORCID,Moritz Guillaume,Durupt Jean,Bernard Christian,Varreau Didier,Pontes Julian^ORCID,Thuries Sebastien,Coriat David,Harrand Michel^ORCID,Dutoit Denis,Lattard Didier,Arnaud Lucile,Charbonnier Jean^ORCID,Coudrain Perceval^ORCID,Garnier Arnaud,Berger Frederic,Gueugnot Alain,Greiner Alain,Meunier Quentin L.^ORCID,Farcy Alexis,Arriordaz Alexandre^ORCID,Cheramy Severine^ORCID,Clermidy Fabien

Funder

French National Program Programme d’Investissements d’Avenir, IRT Nanoelec

SHARP CA109 CATRENE Project

MASTER3D CT312 CATRENE Project

Hubeo+ CARNOT Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/9306027/09290098.pdf?arnumber=9290098

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