A Broadband 22–31-GHz Bidirectional Image-Reject Up/Down Converter Module in 28-nm CMOS for 5G Communications-Reference-Cited by-同舟云学术

A Broadband 22–31-GHz Bidirectional Image-Reject Up/Down Converter Module in 28-nm CMOS for 5G Communications

Published:2022-07 Issue:7 Volume:57 Page:1968-1981
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Quadrelli Fabio¹^ORCID,Manente Davide²,Seebacher David³^ORCID,Padovan Fabio³^ORCID,Bassi Matteo³^ORCID,Mazzanti Andrea¹^ORCID,Bevilacqua Andrea²^ORCID

Affiliation:

1. Department of Industrial and Information Engineering, University of Pavia, Pavia, Italy

2. Department of Information Engineering, University of Padova, Padua, Italy

3. Infineon Technologies Austria AG, Villach, Austria

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/9809766/09748103.pdf?arnumber=9748103

Reference59 articles.

1. A Global Multi-Standard/Multi-Band 17.1-52.4 GHz Tx Phased Array Beamformer with 14.8 dBm OP1dB Supporting 5G NR FR2 Bands with Multi-Gb/s 64-QAM for Massive MIMO Arrays

2. A 24.5–43.5-GHz Ultra-Compact CMOS Receiver Front End With Calibration-Free Instantaneous Full-Band Image Rejection for Multiband 5G Massive MIMO

3. A Broadband Linear Ultra-Compact mm-Wave Power Amplifier With Distributed-Balun Output Network: Analysis and Design

4. A 28-GHz Phased-Array Receiver Front End With Dual-Vector Distributed Beamforming

5. A Millimeter-Wave Mutual-Coupling-Resilient Double-Quadrature Transmitter for 5G Applications

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