Wafer Pattern Counting, Detection and Classification Based on Encoder-Decoder CNN Structure
Author:
Affiliation:
1. Texas Tech University,Department of Computer Science,Lubbock,TX,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9813697/9813750/09813870.pdf?arnumber=9813870
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5. Neural-network approach for semiconductor wafer post-sawing inspection;su;IEEE Transactions on Semiconductor Manufacturing,2002
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