Patterned wafer inspection by high resolution spectral estimation techniques-Reference-Cited by-同舟云学术

Patterned wafer inspection by high resolution spectral estimation techniques

Published:1994-09 Issue:3 Volume:7 Page:178-185
ISSN:0932-8092
Container-title:Machine Vision and Applications
language:en
Short-container-title:Machine Vis. Apps.

Author:

Khalaj Babak H.,Aghajan Hamid K.,Kailath Thomas

Publisher

Springer Science and Business Media LLC

Subject

Computer Science Applications,Computer Vision and Pattern Recognition,Hardware and Architecture,Software

Link

http://link.springer.com/content/pdf/10.1007/BF01211662.pdf

Reference15 articles.

1. Babian F (1986) Optical defect detection limits in semiconductor wafers and masks. PhD thesis, Stanford University, Stanford, Calif.

2. Barth M, Hirayama D, Beni G, Hackwood S (1992) A color vision inspection system for integrated circuit manufacturing. IEEE Trans Semiconductor Manufacturing 5:290?301

3. Browning R, Lincoln I, Stonestorm P (1989) Recent advances in automated patterned wafer inspection. Proceedings SPIE, Integrated Circuit Metrology, Inspection, and Process Control III, pp 440?445

4. Burg JP (1975) Maximum entropy spectral analysis. PhD thesis, Stanford University, Stanford, Calif.

5. Capon J (1983) Maximum-likelihood spectral estimation, In: Haykin, (ed) Nonlinear methods of spectral analysis, 2nd edn, chapter 5. Springer Berlin Heidelberg New York

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