GaN Memory Operational at 300 °C
Author:
Affiliation:
1. Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA
2. Department of Electrical and Electronic Engineering, Bangladesh University of Engineering and Technology, Dhaka-1205, Bangladesh
Funder
National Aeronautics and Space Administration
Lockheed Martin Corporation
Air Force Office of Scientific Research
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/9965979/09933760.pdf?arnumber=9933760
Reference33 articles.
1. A GaN Complementary FET Inverter With Excellent Noise Margins Monolithically Integrated With Power Gate-Injection HEMTs
2. 3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications
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4. Highly-scaled self-aligned GaN complementary technology based on a GaN-on-Si platform;xie;IEDM Tech Dig,2022
5. 1.2-kV Vertical GaN Fin-JFETs: High-Temperature Characteristics and Avalanche Capability
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