Stable High Temperature Operation of p-GaN Gate HEMT With Etch-Stop Layer
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, University of Illinois at Urbana--Champaign, Urbana, IL, USA
Funder
Defense Advanced Research Projects Agency
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/55/10449685/10387459.pdf?arnumber=10387459
Reference30 articles.
1. High-temperature electronics - a role for wide bandgap semiconductors?
2. Extended Exposure of Gallium Nitride Heterostructure Devices to a Simulated Venus Environment
3. GaN Integration Technology, an Ideal Candidate for High-Temperature Applications: A Review
4. Wide bandgap semiconductor materials and devices
5. Extreme Temperature Operation of Ultra-Wide Bandgap AlGaN High Electron Mobility Transistors
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1. High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C;Applied Physics Letters;2024-05-13
2. Device and material investigations of GaN enhancement-mode transistors for Venus and harsh environments;Applied Physics Letters;2024-04-22
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