An Optimal Design for 1.2kV 4H-SiC JBSFET (Junction Barrier Schottky Diode Integrated MOSFET) With Deep P-Well
Author:
Affiliation:
1. College of Nanoscale Science and Engineering, State University of New York Polytechnic Institute, Albany, NY, USA
Funder
Office of Energy Efficiency and Renewable Energy (EERE), U.S. Department of Energy, the Vehicle Technologies Program Office
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://ieeexplore.ieee.org/ielam/55/9762988/9740688-aam.pdf
Reference18 articles.
1. P-type and N-type channeling ion implantation of SiC and implications for device design and fabrication;das;Electrochem Soc Trans,2020
2. Recent Advances in the Doping of 4H-SiC by Channeled Ion Implantation
3. Selection of ion species suited for channeled implantation to be used in multi-epitaxial growth for SiC superjunction devices
4. Improved Short-Circuit Ruggedness for 1.2kV 4H-SiC MOSFET Using a Deep P-Well Implemented by Channeling Implantation
5. Design Optimization of a High Temperature 1.2 kV 4H-SiC Buried Grid JBS Rectifier
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