Author:
Liu Bo-Wen,Yao Shi,Wei Xing-Chang
Cited by
3 articles.
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1. Influence of Solder on De-Embedded Capacitance;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01
2. A Simple Solder-Free Fixture for Surface Mounted Device Measurement;2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2022-08-12
3. A Hybrid De-Embedding Method for Low Loss and Reciprocal PCB Fixtures;IEEE Transactions on Instrumentation and Measurement;2022