Author:
Zhao Biyao,Huang Chenxi,Shringarpure Ketan,Fan Jun,Archambeault Bruce,Achkir Brice,Connor Samuel,Cracraft Michael,Cocchini Matteo,Ruehli Albert,Drewniak James
Cited by
13 articles.
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1. Noise Analysis and Improvement of Power Supply Network Based on Power Integrity;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. Counterfeit Chip Detection using Scattering Parameter Analysis;2023 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS);2023-05-03
3. Disassembling Software Instruction Types through Impedance Side-channel Analysis;2023 IEEE International Symposium on Hardware Oriented Security and Trust (HOST);2023-05-01
4. Chip-Package-Board codesign Methodology for Energy Harvesting DC-DC Boost Converters;2022 37th Conference on Design of Circuits and Integrated Circuits (DCIS);2022-11-16
5. ScatterVerif: Verification of Electronic Boards Using Reflection Response of Power Distribution Network;ACM Journal on Emerging Technologies in Computing Systems;2022-10-13