Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method-Reference-Cited by-同舟云学术

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Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method

Published:2009-05 Issue:5 Volume:19 Page:275-277
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Yaojiang Zhang ,Rimolo-Donadio R.,Jun Fan ,Schuster C.,Li E.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx5/7260/4912591/04840543.pdf?arnumber=4840543

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Time-Domain Analysis and Design of GCPW Vertical Transition Using Eccentric Via-hole in Multilayer PCB;2021 IEEE Asia-Pacific Microwave Conference (APMC);2021-11-28

2. Via Design Optimization for Server Applications;2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE;2020-09-23

3. Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures;IEEE Transactions on Electromagnetic Compatibility;2012-10

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