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Vertical microstrip transition for multilayer microwave circuits with decoupled passive and active layers

  • Published:2006-07 Issue:7 Volume:16 Page:401-403
  • ISSN:1531-1309
  • Container-title:IEEE Microwave and Wireless Components Letters
  • language:
  • Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Casares-Miranda F.P.,Vie C.,Camacho-Penalosa C.,Caloz C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Wideband Microstrip-to-Microstrip Vialess Vertical Transition Based on Multilayer Liquid Crystal Polymer Technology;Journal of Shanghai Jiaotong University (Science);2023-07-01

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