Concurrent Dual-Mode Directional Coupler for Mode-Division Multiplexed Multidrop Substrate-Integrated Waveguide-Based Links
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, CA, USA
Funder
National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
https://ieeexplore.ieee.org/ielam/22/10630575/10416882-aam.pdf
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1. Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications
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3. A Fully Integrated Broadband Sub-mmWave Chip-to-Chip Interconnect
4. THz interconnect: the last centimeter communication
5. A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies
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