Funder
National Natural Science Foundation of China
Beijing Natural Science Foundation
Beijing Key Laboratory of Advanced Manufacturing Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07
2. Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13