A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes
Author:
Affiliation:
1. ams OSRAM, Premstätten, Austria
2. Institute for Microelectronics, TU Wien, Vienna, Austria
3. Christian Doppler Laboratory for Single-Defect Spectroscopy, Institute for Microelectronics, TU Wien, Vienna, Austria
Funder
Austrian Federal Ministry for Digital and Economic Affairs
National Foundation for Research, Technology and Development
Christian Doppler Forschungsgesellschaft
Technische Universität Wien Bibliothek
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/7298/10566496/10480619.pdf?arnumber=10480619
Reference30 articles.
1. Simulating and Modeling the Influence of Deep Trench Interface Recombination on Si Photodiodes
2. Development of small-sized pixel structures for high-resolution CMOS image sensors
3. Impact of Trap States at Deep Trench Sidewalls on the Responsivity of Island Photodiodes
4. Ultra-Low Noise Defect Probing Instrument for Defect Spectroscopy of MOS Transistors
5. Deep‐level transient spectroscopy: A new method to characterize traps in semiconductors
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