Numerical Simulation of Metal Plasma Immersion Ion Implantation (MePIIID) on a Sharp Cone and a Fine Tip by a Multiple-Grid Particle-in-Cell (PIC) Method-Reference-Cited by-同舟云学术

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Numerical Simulation of Metal Plasma Immersion Ion Implantation (MePIIID) on a Sharp Cone and a Fine Tip by a Multiple-Grid Particle-in-Cell (PIC) Method

Published:2006-10 Issue:5 Volume:34 Page:2434-2442
ISSN:0093-3813
Container-title:IEEE Transactions on Plasma Science
language:
Short-container-title:IEEE Trans. Plasma Sci.

Author:

Kwok D.T.K.,Cornet C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Condensed Matter Physics,Nuclear and High Energy Physics

Link

http://xplorestaging.ieee.org/ielx5/27/36081/01710139.pdf?arnumber=1710139

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