Power from Below: Buried Interconnects Will Help Save Moore's Law-Reference-Cited by-同舟云学术

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Power from Below: Buried Interconnects Will Help Save Moore's Law

Published:2021-09 Issue:9 Volume:58 Page:46-51
ISSN:0018-9235
Container-title:IEEE Spectrum
language:
Short-container-title:IEEE Spectr.

Author:

Cline Brian,Prasad Divya,Beyne Eric,Zografos Odysseas

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/6/9531028/09531012.pdf?arnumber=9531012

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. System technology co-optimization for advanced integration;Nature Reviews Electrical Engineering;2024-09-02

2. Block level and package level thermal assessment for back side power delivery network.;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Simulation on Microstructural Evolution under Electromigration in Backside Power Delivery Network;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Increasing Functionality of Wafer’s Backside: Analysis of Si and WS₂ Backside Power-Switch;IEEE Transactions on Electron Devices;2023-07

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