Defects tail off with six-sigma manufacturing

Author:

Fieler P.E.,Loverro N.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory;2022 IEEE International Reliability Physics Symposium (IRPS);2022-03

2. A six sigma based approach to evaluate the on time performance of Indian railways;International Journal of Quality & Reliability Management;2018-11-29

3. Stress-induced voiding in nickel silicide;Microelectronic Engineering;2013-06

4. A Framework for Modeling Impact of Intrinsic Parameter Fluctuations at Architectural-Level;2009 International Conference on Signal Processing Systems;2009

5. An IC yield enhancement approach by ARMA modeling and dynamic process control;The International Journal of Advanced Manufacturing Technology;2008-07-30

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