Review of Back-Side Illuminated 3-D-Stacked SPADs for Time-of-Flight and Single-Photon Imaging
Author:
Affiliation:
1. School of Engineering, Institute for Integrated Micro and Nano Systems, University of Edinburgh, Edinburgh, U.K.
2. Imaging Division, STMicroelectronics, Edinburgh, U.K.
Funder
STMicroelectronics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/16/10538150/10507861.pdf?arnumber=10507861
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