登录 注册 会员服务 联系我们

Adhesion measurement for electronic packaging applications using double cantilever beam method

  • Published:2000-03 Issue:1 Volume:23 Page:101-116
  • ISSN:1521-3331
  • Container-title:IEEE Transactions on Components and Packaging Technologies
  • language:
  • Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Xiang Dai ,Brillhart M.V.,Ho P.S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 39 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fatigue-Fracture Propensity Measurement and Competing Risk Model for FCBGA Interfaces under Sustained Humidity and Temperature Exposure;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review;The Journal of Adhesion;2024-05-09

3. Assessment of Competing Risk-of-Failure in FCBGA Interfaces Operating in Harsh Automotive Underhood Environments for Periods up to 1-Year;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

4. Electrospun fiber-based flexible electronics: Fiber fabrication, device platform, functionality integration and applications;Progress in Materials Science;2023-08

5. Chip-Underfill Interface Damage Model Under Fatigue Loading after Sustained High-Temperature Exposure;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3