Natural convection air cooling of electronic components in partially open compact horizontal enclosures-Reference-Cited by-同舟云学术

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Natural convection air cooling of electronic components in partially open compact horizontal enclosures

Published:2000-03 Issue:1 Volume:23 Page:14-22
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Yu E.,Joshi Y.K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/18032/00833037.pdf?arnumber=833037

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