Investigation on Immersion Cooling Solution for Hyper-scale Data Center Application-Reference-Cited by-同舟云学术

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Investigation on Immersion Cooling Solution for Hyper-scale Data Center Application

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Wang Yulong¹,Gui Chenglong¹,Cheng Pengfei¹,Shen Chen¹,Wang Ruidong¹,Lv Zhichao¹,Lin Bin¹,Tian Wenbin²,Li Zhiming²,Zhang Xu²,Zhang Ken²,Wu Lihui²,Ahuja Nishi²

Affiliation:

1. ByteDance Technology

2. Intel Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177671.pdf?arnumber=10177671

Reference19 articles.

1. System-level experimental investigations of the direct immersion cooling data center units with thermodynamic and thermoeconomic assessments

2. Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility

3. Single Phase Passive Hydrocarbon Immersion Cooling of High-power ICs

4. Single-Phase Immersion Cooling Performance in Intel Servers with Immersion Influenced Heatsink Design;sarangi;2022 38th Semiconductor Thermal Measurement Modeling & Management Symposium (SEMI-THERM),0

5. Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanism and kinetics study of the chemically initiated oxidative polymerization of hexafluoropropylene;AIChE Journal;2024-07-23

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