Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility

Published:2012-11 Issue:23-24 Volume:55 Page:6391-6399
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Zimmermann Severin,Tiwari Manish K.,Meijer Ingmar,Paredes Stephan,Michel Bruno,Poulikakos Dimos

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference24 articles.

1. Cooling energy-hungry data centers;Meijer;Science,2010

2. 3D integrated water cooling of a composite multilayer stack of chips;Alfieri;J. Heat Transf.-Trans. ASME,2010

3. Thermal management of vertically integrated packages;Brunschwiler,2008

4. Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics;Renfer;Experiments in Fluids,2011

5. A practical implementation of silicon microchannel coolers for high power chips;Colgan;IEEE Trans. Compon. Packaging Technol.,2007

Cited by 62 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heat Transfer and Fluid Flow Characteristics in a Micro Heat Exchanger Employing Warm Nanofluids for Cooling of Electronic Components;Energies;2024-05-15

2. A Review of Techniques for Effective Thermal Management in Power Electronics;2024

3. Using artificial intelligence and two-phase numerical simulation method for investigating the effect of the shape of pin fins on the entropy production of nanofluid flow in a heatsink at different flow rates;Engineering Analysis with Boundary Elements;2023-10

4. Model Predictive Control for Carbon-Neutral Data Centers;2023 IEEE International Conference on Systems, Man, and Cybernetics (SMC);2023-10-01

5. Thermodynamic performance of Al2O3-Cu-CuO/water (W) ternary nanofluids in the full-flow regime of convective heat transfer;Experimental Thermal and Fluid Science;2023-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3