Hotspot-targeted Cooling Scheme with Hybrid Jet Impingement/Thermal Through Silicon Via (TSV)
Author:
Affiliation:
1. School of Mechanical Engineering, Purdue University,West Lafayette,IN,47907
2. Stanford University,Department of Mechanical Engineering,Stanford,CA,94305
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177590.pdf?arnumber=10177590
Reference21 articles.
1. Fluid Flow and Heat Transfer in a Novel Microchannel Heat Sink Partially Filled With Metal Foam Medium
2. Performance analysis of hotspot using geometrical and operational parameters of a microchannel pin-fin hybrid heat sink
3. HEAT TRANSFER AND FLOW FIELDS IN CONFINED JET IMPINGEMENT
4. Numerical model and analysis of heat transfer during microjets array impingement;lapka;Energy,2020
5. Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
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