Funder
Defense Advanced Research Projects Agency
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference43 articles.
1. A. Bar-Cohen, J.J. Maurer, J.G. Felbinger, DARPA’s intra/interchip enhanced cooling (ICECool) program, in: Proceedings of the Compound Semiconductor Manufacturing Technology Conference (CS MANTECH), 2013, pp. 171–174.
2. K.P. Bloschock, A. Bar-Cohen, Advanced thermal management technologies for defense electronics, in: Proceedings of SPIE 8405, Defense Transformation and Net-Centric Systems, 2012, pp. 84050I-84050I–12.
3. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Dev. Lett.,1981
4. Single-phase convective heat transfer in microchannels: a review of experimental results;Morini;Int. J. Therm. Sci.,2004
5. Transport in microchannels-a critical review;Garimella;Ann. Rev. Heat Transfer,2003
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