Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology-Reference-Cited by-同舟云学术

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Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology

Published:2024-10 Issue: Volume:305 Page:132263
ISSN:0360-5442
Container-title:Energy
language:en
Short-container-title:Energy

Author:

He Wei,Yin Ershuai^ORCID,Zhou Fan,Zhao Yang,Hu Dinghua,Li Jiaqi^ORCID,Li Qiang

Publisher

Elsevier BV

Reference44 articles.

1. A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs);Salvi;IEEE Trans Compon Packag Manuf Technol,2021

2. Recent advances and trends in advanced packaging;Lau;IEEE Trans Compon Packag Manuf Technol,2022

3. Monolithic microfluidic cooling of a heterogeneous 2.5-D FPGA with low-profile 3-D printed manifolds;Rajan;IEEE Trans Compon Packag Manuf Technol,2021

4. On-chip batteries as distributed energy sources in heterogeneous 2.5D/3D integrated circuits;Dehghanzadeh;IEEE Access,2023

5. The ICECool fundamentals effort on evaporative cooling of microelectronics;Bar-Cohen;IEEE Trans Compon Packag Manuf Technol,2021

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1. Enhancing data center cooling efficiency and ability: A comprehensive review of direct liquid cooling technologies;Energy;2024-11

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