Numerical Investigation of Silicon-Embedded Microchannel Structures Containing Different Shaped Interior Flow-Splitting Walls and Micro Pin-Fins for Hotspot Mitigation of GaN High-Power Devices-Reference-Cited by-同舟云学术

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Numerical Investigation of Silicon-Embedded Microchannel Structures Containing Different Shaped Interior Flow-Splitting Walls and Micro Pin-Fins for Hotspot Mitigation of GaN High-Power Devices

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Yıldız Orçun¹

Affiliation:

1. Aselsan Inc.,Ankara,Turkey

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177507.pdf?arnumber=10177507

Reference29 articles.

1. Effect of relative waviness on low Re wavy microchannel flow;krishna;Journal of The Institution of Engineers (India): Series B,2020

2. Investigation of wavy microchannel ability on electronic devices cooling with the case study of choosing the most efficient microchannel pattern

3. Numerical analysis of micro-pin-fin heat sink cooling in the mainboard chip of a CPU

4. Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot

5. Performance improvements of microchannel heat sink using wavy channel and nanofluids

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