Influence of Thermal Cycling on Degradation Behavior of Thermal Greases-Reference-Cited by-同舟云学术

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Influence of Thermal Cycling on Degradation Behavior of Thermal Greases

Published:2023-05-30 Issue: Volume: Page:
ISSN:
Container-title:2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Nagrani Pranay P.¹,Kulkarni Ritwik V.¹,Marconnet Amy M.¹

Affiliation:

1. School of Mechanical Engineering, Purdue University,West Lafayette,IN,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177495.pdf?arnumber=10177495

Reference17 articles.

1. Drainage-Induced Dry-Out of Thermal Greases

2. An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications;chiu;Proceedings - Electronic Components and Technology Conference,0

3. Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

4. Voids in thermal interface material layers and their effect on thermal performance

5. New developments for a no-pump-out high-performance thermal grease

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Semi-in-situ thermal transport characterization of thermal interface materials through a low-frequency thermoreflectance technique;Measurement;2025-01

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