Test device design and test procedure for non-destructive characterization of Bi phase accumulation during electromigration
Author:
Affiliation:
1. Purdue University,Dept. of Mechanical Engineering,West Lafayette,Indiana
2. Purdue University,Dept. of Materials Engineering,West Lafayette,Indiana
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177512.pdf?arnumber=10177512
Reference9 articles.
1. Effects of silver doping on electromigration of eutectic SnBi solder
2. Electromigration behaviors in Sn–58Bi solder joints under different current densities and temperatures
3. Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging
4. Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect
5. Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fabrication and Testing of In-Line Structures for Non-Destructive Study of Solder Electromigration: Applications to SnBi Low Temperature Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints;Journal of Electronic Materials;2024-04-17
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