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Experimental and Numerical Analyses of Multiple Jets Impingement Cooling for High-Power Electronics

  • Published:2018-02 Issue:2 Volume:8 Page:210-215
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Leena RadhamonyORCID,Syamkumar GopalakrishanORCID,Jose Prakash MathaiORCID

Funder

Technical Education Quality Improvement Program (TEQIP-II)

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the effect law of jet angle on the cooling of hot-rolled L-beam;Numerical Heat Transfer, Part A: Applications;2024-04-21

2. Investigation of Heat Transfer Increment in Electronic System Surfaces by Different Air Jet Impingement Applications;Journal of Engineering Thermophysics;2024-03

3. Experimental and 3D computational fluid dynamics (CFD) investigation of multiple arrays of jet impingement on a flat surface;International Journal of Thermal Sciences;2024-01

4. Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06

5. A study on microchip cooling performance increment by using air jet impingement with one and double rows;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2023-05-24
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