3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives-Reference-Cited by-同舟云学术

3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives

Published:2013-06 Issue:6 Volume:3 Page:935-942
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ghannam Ayad,Bourrier David,Ourak Lamine,Viallon Christophe,Parra Thierry

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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