Broadband Dielectric Properties of Integrated Circuit Packaging Materials Across the 6G Spectrum
Author:
Affiliation:
1. Department of Physics, Texas Analog Center of Excellence, The University of Texas at Dallas, Richardson, TX, USA
Funder
Semiconductor Research Corporation (SRC) through the Texas Analog Center of Excellence
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/9913798/09849118.pdf?arnumber=9849118
Reference21 articles.
1. Broadband Terahertz Refraction Index Dispersion and Loss of Polymeric Dielectric Substrate and Packaging Materials
2. Dielectric relaxation in solids
3. Generalized Lyddane-Sachs-Teller relation and disordered solids
4. Millimeter-Wave Complex Permittivity of Silica/Alumina-Filled Epoxy-Molding Compounds
5. Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials
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