High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects

Author:

Lu QijunORCID,Zhu ZhangmingORCID,Yang Yintang,Ding Ruixue,Li Yuejin

Funder

National Natural Science Foundation of China

National Science and Technology Major Project of China

Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory

Shaanxi S & T coordinate innovation Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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2. High-Frequency Electromagnetic Eddy Effect Modeling for Cylindrical and Tapered Bump;IEEE Transactions on Electromagnetic Compatibility;2023-12

3. A Compact Sixth-Order Common-Mode Noise Suppression Filter Based on 3-D Integration Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04

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5. Design of broadband cross-coupled SIW filter based on TSV;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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