Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire

Author:

Li Qi1,Li Yang-Bo1,Fu Hao-Dong1,Tu Chun-Ming1ORCID,Xiao Biao1,Xiao Fan1ORCID,Zhai Dong-Yuan1ORCID,Lu Ji-Wu1ORCID

Affiliation:

1. College of Electrical and Information Engineering, Hunan University, Hunan, Changsha, China

Funder

National Key Research and Development Program of China

SiC MOSFET Chips for New Energy Vehicles

Science and Technology Innovation Program and Natural Science Foundation of Hunan Province

“The Open Competition Mechanism to Select the Best Candidates” Program of Changsha

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires;Microelectronics Reliability;2024-11

2. Multiphysics Coupling in IGBT Modules: A Review;Journal of Electronic Packaging;2024-07-26

3. Reliability Meta-modelling of Power Components;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

4. A Detection Method for Local Wire Bond Failure in IGBT Based on High-Frequency Time-Domain Reflective Signal Response Analysis;2024 IEEE 2nd International Conference on Power Science and Technology (ICPST);2024-05-09

5. Physics-informed Machine Learning for Predicting Fatigue Damage of Wire Bonds in Power Electronic Modules;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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