Influence of Contact Pressure on the Specific Electrical Contact Resistance of Copper-Reference-Cited by-同舟云学术

Influence of Contact Pressure on the Specific Electrical Contact Resistance of Copper

Published:2022-06 Issue:6 Volume:12 Page:973-980
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Biele Lukas¹^ORCID,Schaaf Peter¹^ORCID,Schmid Florian²

Affiliation:

1. Robert Bosch GmbH, Corporate Sector Research and Advance Engineering, Stuttgart, Germany

2. Chair Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering and Institute of Micro and Nanotechnology MacroNano, TU Ilmenau, Ilmenau, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9805411/09779213.pdf?arnumber=9779213

Reference16 articles.

1. Cu-ETP (CW004A) datasheet;kupferinsitut,2005

2. Comparison between stress-strain plots obtained from indentation plastometry, based on residual indent profiles, and from uniaxial testing

3. Method for contact resistance determination of copper during fast temperature changes

4. Native Oxide Layers Formed on the Surface of Ultra High-Purity Iron and Copper Investigated by Angle Resolved XPS

5. Testing and modeling of contact problems in resistance welding;song,2003

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