Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

Published:2012-09 Issue:9 Volume:2 Page:1412-1419
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lee Chang-Chun,Yang Tsung-Fu,Kao Kuo-Shu,Cheng Ren-Chin,Zhan Chau-Jie,Chen Tai-Hong

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6293929/06238315.pdf?arnumber=6238315

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology;Journal of Nanoscience and Nanotechnology;2018-08-01

2. An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

3. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests;Materials;2017-10-24

4. Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

5. Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology;Microelectronics Reliability;2015-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3