Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates-Reference-Cited by-同舟云学术

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Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

Published:2012-08 Issue:8 Volume:2 Page:1260-1264
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Kim Cheol Ho,Kwon Young-Se

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6255833/06138297.pdf?arnumber=6138297

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Wideband Symmetrical Crossover Model With Analytic Analysis and Its Millimeter-Wave Application;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

2. A Circular Millimeter-Wave Printed Ridge-gap-Waveguide Crossover;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23

3. Embedded Passives;Materials for Advanced Packaging;2016-11-19

4. Correction on “Effect of Temperature Variation and Packaging on SOI MEMS Inductor With DRIE Trench on Low-Resistivity Substrate” [Feb 14 400-407];IEEE Transactions on Electron Devices;2015-01

5. High‐performance stacked‐coil transformers with thick metal layers;Electronics Letters;2014-09

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