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Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

  • Published:2013-07 Issue:7 Volume:3 Page:1084-1093
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Nguyen Hoang-Vu,Andreassen Erik,Kristiansen Helge,Aasmundtveit Knut E.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal transport in silver-coated polymer sphere composites by the bidirectional 3ω method;Journal of Applied Physics;2022-03-28

2. Mechanical Testing of Conductive Adhesives;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15

3. Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review;Polymer-Plastics Technology and Engineering;2017-09-18

4. Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

5. Effect of SDS decoration of graphene on the rheological and electrical properties of graphene-filled epoxy/Ag composites;Journal of Materials Science: Materials in Electronics;2016-08-04
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